Nitriding of metals - Import export

Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.

DPC Ceramic Substrate Advantages: > In terms of shape processing, DPC ceramic substrate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. > The crystal performance of the metal is good; > The flatness is good; > The line is not easy to fall off; > The line position is more accurate, the line distance is smaller, reliable and stable, can be through the hole and other advantages.

AMB (Active Metal Brazing) is for joining ceramics that are not wetted by 'conventional' brazes.By applying active metal like titanium to be added to the braze alloy, to achieve chemically reacts with the surface of the parent ceramic.Due to the coefficient of thermal expansion of Al2O3 (7.1 ppm/K), Si3N4 (2.6 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K), Direct Bond Copper (DBC) and AMB are suitable substrates for robust packaging of bare dice since such assemblies.AMB is the promising thick film technology which can be applied to Power Electronics, Automotive Electronics, Home Appliances, Aerospace, Others. INNOVACERA provide DBC, DPC, and AMB technology for customized ceramic substrates, welcome to consult more.