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Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid
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Metal stamping parts are widely used as metal casing/housing in which all electronics components and PCB board will be assembled, they are designed to be different shapes with various kinds of surface finish, metal material makes the whole light long durability and heat resistance compared to plastic parts, they can be formed by stamping, deep drawing, spinning or TIG welding.
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