Functional polymers - Import export

THE SYNERGY OF LARGE BUILD VOLUME AND HIGH-TEMPERATURE THERMAL DESIGN. High-temperature chamber for printing large functional parts with material PEEK Polymer without warpage & delamination.

THE SYNERGY OF LARGE BUILD VOLUME AND HIGH-TEMPERATURE THERMAL DESIGN. High-temperature chamber for printing large functional parts with material PEEK Polymer without warpage & delamination. Large Scale. High Temperature. Industrial Production.

THE SYNERGY OF LARGE BUILD VOLUME AND HIGH-TEMPERATURE THERMAL DESIGN. High-temperature chamber for printing large functional parts with material PEEK Polymer without warpage & delamination.

THE SYNERGY OF LARGE BUILD VOLUME AND HIGH-TEMPERATURE THERMAL DESIGN. High-temperature chamber for printing large functional parts with material PEEK Polymer without warpage & delamination. Large Scale. High Temperature. Industrial Production.

THE SYNERGY OF LARGE BUILD VOLUME AND HIGH-TEMPERATURE THERMAL DESIGN. High-temperature chamber for printing large functional parts with material PEEK Polymer without warpage & delamination. Large Scale. High Temperature. Industrial Production.

Product Identification Chemical name: Bis[2-(3,4-epoxycyclohexyl)ethyl]tetramethyldisiloxane Synonyms: Diepoxycyclohexanethyl-1,1,3,3-tetramethyldisiloxane CAS No.: 18724-32-8 Molecular formula: C20H38O3Si2 Molecular weight: 382.68 Boiling point: 400 °C @ 760 mmHg Density: 0.997 g/mL Refractive index: 1.476 Specification Appearance: Colorless transparent liquid Purity: 98.00%min by GC Moisture: 0.50%max Package Regular Packing: N.W 20kg/200kg iron drum lined with plastic Sample Packing: 0.1kg-1kg plastic bottle Transport Information Classification: Non-dangerous goods HS Code: 2931909090 Status & Application Status: Industrial scale Application: Bis[2-(3,4-epoxycyclohexyl)ethyl]tetramethyldisiloxane contains epoxy groups, the epoxy groups have high reactivity, and polysiloxane with the epoxy groups can obtain a novel functional organic silicon polymer through further ring-opening reaction of the epoxy groups.