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OPSIL LTD
Bulgaria
Depending on the customers’ orders, the crystals are being ground on the outside diameter of a diamond peripheral sawing disk. We have got three centre grinders with a total monthly capacity 2000 kg. Maximum ground diameter – Ф200 mm. Accuracy 0.03 mm. Surface roughness - Ra ˂ 0.25.
Request for a quoteOPSIL LTD
Bulgaria
After having pulled the crystal out, it is placed in the sawing machine, where the initial and the end cone are being cut out. Thereafter, the cylindrical part is cut-to-length, as requested. Diamond discs for peripheral sawing are used for cutting.
Request for a quoteOPSIL LTD
Bulgaria
After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.
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