Germany, Magdeburg
... using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).

The europages app is here!

Use our improved supplier search or create inquiries on the go with the new europages app.

Download in the App Store

App StoreGoogle Play