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LogoMICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG
Switzerland, Baar
96km
...The core competencies of the MST Group within semiconductor technology lie in the area of semiconductor packaging. Custom packaging solutions are available through a large and diverse range of base materials, forms, and housing configurations. The latest technological development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small to medium quantities using transfer presses...
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Semiconductor Packaging
Semiconductor Packaging
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Test Service
Test Service
Primary batteries for implants with maximum performance...
Primary batteries for implants with maximum performance...
LTCC (Low Temperature Co-Fired Ceramic) Substrate
LTCC (Low Temperature Co-Fired Ceramic) Substrate
Printed Circuit Boards and Chip Packaging Substrates
Printed Circuit Boards and Chip Packaging Substrates
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