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MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG

Neuhofstrasse 4, Baar 6340
Switzerland
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Delivery: Worldwide
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Production
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6 Product and services

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Semiconductor Packaging
The core competencies of the MST Group within semiconductor technology lie in the area of semiconductor packaging. Custom packaging solutions are avai...
Test Service
The MST Group has extensive testing procedures to ensure the required performance of components, assemblies, or modules. In manufacturing, the MST co...
Primary batteries for implants with maximum performance...
Die Lithium-Iod- und die Lithium-Mangandioxid-Technologie bilden die Basis unserer Standardproduktlinien und stehen für kundenspezifische Batterielösu...
LTCC (Low Temperature Co-Fired Ceramic) Substrate
Construction of 2 to more than 20 layers, embedding of passive components such as capacitors, inductors, and resistors LTCC (Low Temperature Co-Fired...
Printed Circuit Boards and Chip Packaging Substrates
HDI/Microvia circuit board solutions and chip packaging substrates for all applications where miniaturization, high performance, high frequencies, and...
Construction and Connection Technology
The MST Group has many years of experience in the development and manufacturing of complex, miniaturized electronic modules for medical devices and ot...

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Location and contact

MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG
AddressNeuhofstrasse 4, CH-6340 Baar

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