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LogoMICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG
Switzerland, Baar
21km
...laser marking, and singulation. Base Materials > LTCC > Al2O3 > PCB I/O Configurations > Ball Grid Array (BGA) - Stacked Die BGA (SDBGA) - High Voltage BGA > Land Grid Array (LGA) > Castellation > Single In-Line / Dual In-Line (SIL/DIL) > Quad Flat Packages (QFP) Enclosures Non-hermetically sealed enclosures using plastic/metal covers or organic coatings Hermetically sealed enclosures through soldering...
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Semiconductor Packaging
Semiconductor Packaging
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Test Service
Primary batteries for implants with maximum performance...
Primary batteries for implants with maximum performance...
LTCC (Low Temperature Co-Fired Ceramic) Substrate
LTCC (Low Temperature Co-Fired Ceramic) Substrate
Printed Circuit Boards and Chip Packaging Substrates
Printed Circuit Boards and Chip Packaging Substrates
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