wafers Germany

...Oreo Biscuit is a popular sandwich cookie that consists of two chocolate-flavored wafers with a sweet cream filling in between. It was first introduced by the National Biscuit Company (now known as Nabisco) in 1912 and has since become one of the most beloved and recognizable cookie brands worldwide. The chocolate wafers of an Oreo Biscuit are made from a combination of cocoa powder, flour, sugar...

Micro-Epsilon stands for innovation and continuity, as well as for sustainable growth and the pursuit of greater precision. The portfolio includes sensors for displacement, distance, position, thickness, 2D/3D measurement technology, laser scanners, micrometers, fiber optic sensors, sensors for color detection and color measurement, infrared temperature sensors, thermal imaging cameras, sensors fo...

...Highest performance range with a large format range, Excellent packaging quality, Packaging in one or two materials, also glued/sealed The excellent, compact folding wrapping machine for a performance range of up to 1,150 packages per minute. The machine is preferably used in the confectionery industry and packages coated and shaped chocolate bars, tablets, and small bars or nougats, wafers, and...

... intrusion of grinding coolant. 3) Prevents wafer offset during grinding and dicing. 4) After heating to 130 °C, the film offers low adhesion for easy removal of diced pieces. Mainly used in: 1) Grinding and cutting of silicon wafers and protection of the cutting process for various packages (semiconductor manufacturing in the Front of Line process). 2) Acid treatment protection for screen glass in mobile phones, tablets, etc. 3) Protection of the back side in the non-powered wafer plating process. 4) CNC machining protection. Country of origin: China Total thickness: 105 µm Structure: PET/Adhesive...

...With the LeviWafer transport system, it is possible to lift and transport sensitive wafers without contact. In combination with the transport, it is also possible to load and unload cassettes or stacks. The contactless gripper holds the wafer at a distance, thus allowing for contactless transport. This prevents micro-scratches and contamination. Features of the LeviWafer Gripper: - Contactless grip - Different lengths available - Suitable for standard cassettes - Customizable according to customer specifications...

...The H112 can easily accommodate 12-inch wafers (300 mm) and works with many robotic arm wafer loaders. The H112 table is ideal for scanning a variety of semiconductor wafers, photomasks, flat panels, and printed circuit boards. The H112 can easily accommodate 12-inch wafers (300 mm) and works with many robotic arm wafer loaders. Additionally, the H112 can be used for transmission applications...

...To process wafers without damage, they must be held using vacuum clamping plates or vacuum chucks. The excerpt shows an exemplary design of the suction channels.

...This technology platform enables the structuring of thin membranes based on silicon wafers or SOI wafers, also using wafer bonding techniques. The membranes can consist of various thin layers or layer stacks. Established material systems include membrane materials such as Si, SiO2, Si3N4, AlN, and graphene, as well as electrode materials like Al, Au, Pt, and metallic glass. After assembly, the...

...3DMicromac’s microMIRA™ LLO system provides highly uniform, force free lift off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The laser system can be used for a variety of applications, such as GaN...

... strong wear resistance, and can be combined with a variety of binders. Application areas: Especially suitable for precision polishing of optical products, silicon wafers, etc., and can also be used for precision grinding wheels for polishing sapphire and jade, etc., and suitable for precision grinding and polishing of different materials such as machinery, ceramics, gemstones, semiconductors, etc. It can also be used to prepare metal-bonded diamond tools, electroplated diamond products and other diamond tools.

...Product features: The diamond particles are round or spherical, with smooth edges and corners, suitable for precision grinding or polishing of various materials. High-grade single-crystal synthetic diamonds are used as raw materials. Application areas: Especially suitable for precision polishing of optical products, silicon wafers, etc., and can also be used for precision grinding wheels for...

...NanoTest VCSEL measures VCSEL on wafer level or Chip on Carrier regarding their optical and electrical characteristics. The tester accommodates wafers with a diameter of up to 6 inches (150 mm), as an option also larger diameters can be integrated. A special interface mounted to the chuck also allows for testing Chip on Carrier devices.A high-precision motion system with XYZ and rotary adjustment...

...Increasingly, unpackaged DIEs are being processed directly, which is why we offer automatic packaging of bare dies, CSPs, etc., directly from the wafer into SMD tape. - Component sizes from 0.28 to 8mm - Flip Chip - Wafer mapping or ink sorting - Wafers from 4" to 12"...

...parts of the injection system, sheets, engine blocks, parts of the braking system Tool Industry Inspection of tools, abrasives, hardness impressions, printing cylinders, and their wear Semiconductor Industry Quality control for semiconductors, wafers, MEMS, circuit boards, solar cells, fuel cells Materials Engineering Inspection of coatings, material...

... includes: Silicon: Targets, Wafers Glasses: Quartz/Silicon Dioxide (SiO2), other glasses Ceramics: Aluminum Oxide (Al2O3), Zirconium Dioxide (ZrO2), composite ceramics Piezoelectric materials, composite materials Magnetic materials, ferrites The range of designs varies from simple shapes to geometrically complex custom parts. We offer a comprehensive service from single production to small and medium series, as well as large quantities for industry and research and development.

The industry focuses of our testing systems are in the manufacturing of solar wafers, cells, and modules, in the automotive industry, the semiconductor industry, and medical technology. With years of experience in testing and measurement technology, we can tackle demanding tasks using the latest technologies. The mechanical integration and manufacturing are carried out quickly and efficiently by...

... itself over 28 years through excellent service, customer proximity, and high-quality products. Today, many renowned manufacturers of electronic components as well as PV wafers, solar cells, and modules across Europe count among our customers. In August 2012, a new department with a showroom for the sale of infrared heating systems for residential and commercial use was opened. GS Electronic GmbH supports "Foerderkreis-Brasilien".

... in the photovoltaic and semiconductor industries use slurry to produce silicon wafers from mono- or multicrystalline silicon blocks. The suspension consists of a fine-grained, sharp-edged abrasive (usually silicon carbide) and a viscous carrier liquid (usually polyethylene glycol or dipropylene glycol), which acts as a transport and cooling medium during the sawing process. Through our complex...

Manufacturer of wafers and bars for industry and trade.

Disc grinding machines; Stamp grinding machines; Grinding and polishing machines; Grinding and brushing machines; Precision flat grinding machines; Rotary table flat grinding machines; High-performance flat grinding machines; Tuning grinding machines; Semiconductor grinding machines; Fully automatic wafer grinding machines; Automatic inner hole saws; Precision grinding machine for processing mono- and polycrystalline silicon blocks for solar wafers; Grinding technology...