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Chips

GermanyFrankfurt am Main and HesseManufacturer/producer
  1. IC-LOGIC GMBH

    Germany

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    IC-LOGIC Microchips is one of the leading development companies in the analogue, digital and mixed signal fields, as well as complex System-on-Chip ASIC developments. Our team has developed over 50 ASICs for the most varied customers in the automotive, industrial, aeronautical, consumer and telecommunication fields. Alongside this, our team has also implemented some system developments (module development incl. application software) for some customers. IC-LOGIC was founded in April 2008 by veterans of the semiconductor industry. The company is based in Sulzbach in the Taunus district, very close to Frankfurt am Main. Since we are independent from semiconductor manufacturers, IP suppliers as well as test "assembly and packaging" companies, we are able to provide the best possible solution at the lowest cost to our customers. Our ultimate goal is to build close and long-term collaboration with our customers in order to enable them to put their innovative and cost-effective products on the market at the optimum time.

  2. NANOSYSTEC GMBH

    Germany

    Tailored precision systems for industrial production. Nanosystec is the strong partner by your side for numerous technology and industrial companies worldwide. Customers include internationally active companies from data communication and opto-electronics, as well as from the automotive or medical sector. With more than 25 years of practical experience in the realisation of demanding and high-precision production processes, Nanosystec provides a technology advantage for your project, too. Laser balancing and precise cutting: Modern laser sources combined with high-performance image processing are the prerequisite for fine laser balancing stations with precision material ablation as well as exact contours for precise cutting. Placing in the micro range (< 1 µm): Typical examples including the placing of semiconductor components, optics, apertures and similar components through adhesion, selective soldering, eutectic bonding and laser welding. Active alignment in the nano range (< 100 nm): Active alignment of opto-electronic components with a feedback signal guarantees optimal coupling efficiency. A permanent connection is made using adhesion, laser welding or laser soldering. Optical and electrical characterisation: Essential parameters are measured for opto-electronic components – performance curves as a function of the current, spectral values (wavelength, bandwidth), spatial characteristics, modulation levels and transfer functions.

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  3. COPERION PELLETIZING TECHNOLOGY GMBH

    Germany

    The company COPERION PELLETIZING TECHNOLOGY GMBH, is a Manufacturer/ Producer, which operates in the Granulation, plastics - machinery industry. It also operates in the chipping machines, and granulation of plastic materials industries. It is based in Offenbach, Germany.

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