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Bonding technology

2 Companies

28 Products

DYMAX EUROPE GMBH

Germany

Dymax is one of the world's leading manufacturers of innovative light-curing materials, fluid dispense systems and UV/LED light-curing equipment for industrial applications. The globally positioned company with European headquarters in Wiesbaden has 40 years of development and production expertise in the area of light-curing adhesives, films and seals. The UV adhesives, films, casting compounds, seals and masking agents in its extensive range are monoconstituent, and most materials are solvent-free. The industrial adhesives from Dymax are designed for bonding a wide range of substrates, sometimes even those that are difficult to bond, such as plastics, glass, metals, etc. Furthermore, Dymax also develops and sells the LED and UV light-curing equipment appropriate for this, which guarantees the fast curing of light-curing adhesives, films and UV printing inks using medium to high-intensity LED, UV or visible light.

All the products for "bonding technology"

Dymax Ultra Light-Weld® 9501-F

Dymax Dual-Cure 9014

Dymax Dual-Cure 9483

Dymax MD® 1406-M

Dymax MD® 1040-M

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NANOSYSTEC GMBH

Germany

Tailored precision systems for industrial production. Nanosystec is the strong partner by your side for numerous technology and industrial companies worldwide. Customers include internationally active companies from data communication and opto-electronics, as well as from the automotive or medical sector. With more than 25 years of practical experience in the realisation of demanding and high-precision production processes, Nanosystec provides a technology advantage for your project, too. Laser balancing and precise cutting: Modern laser sources combined with high-performance image processing are the prerequisite for fine laser balancing stations with precision material ablation as well as exact contours for precise cutting. Placing in the micro range (< 1 µm): Typical examples including the placing of semiconductor components, optics, apertures and similar components through adhesion, selective soldering, eutectic bonding and laser welding. Active alignment in the nano range (< 100 nm): Active alignment of opto-electronic components with a feedback signal guarantees optimal coupling efficiency. A permanent connection is made using adhesion, laser welding or laser soldering. Optical and electrical characterisation: Essential parameters are measured for opto-electronic components – performance curves as a function of the current, spectral values (wavelength, bandwidth), spatial characteristics, modulation levels and transfer functions.

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Bonding technology

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2 Companies