... semiconductor industries. a.Based material: white alumina ceramic, and the content of alumina is no less than 95%.The tungsten slurry is printed on the ceramic tape, laminated by hot pressing, and thensintered under the protection of a hydrogen atmosphere at 1650 ° C b.Ni-wires:N6 Ni-wires with 0.6mm diameter c.Brazing material: siliver-copper braging alloy Application: We are producing...
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