... processes for the production of an electronic module from a single source: - Design service for ceramic, organic, and other substrates, such as thin film, DCB, etc. - Substrate manufacturing: LTCC, thick film - Assembly processes, such as SMT, flip chip, wire bonding, die attach, etc. on any base materials - Packaging processes for BGA, LGA, QFP, etc. - Special services, such as custom testing, project management, validation, global material procurement, etc.
Germany, München
... communication. The card products are complemented by custom packaging solutions. Elatec CCS's production is certified according to the security regulations of the GSM Association (Security Accreditation Scheme, SAS) as well as ISO9001 and ISO27001.

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