TEPROSA GMBH

We offer our customers laser cutting of fine and thin sheets, as well as laser fine cutting of materials with very low material thicknesses (0.02 mm – 4.00 mm) as contract manufacturing. Of course we manufacture from the first sample and also up to mass production. If you do not know whether your material is suitable for processing with the laser, we will be happy to find out for you and provide you with a first demonstration sample free of charge.

Laser drilling is a non-chipping drilling technique for producing fine holes in various materials and material thicknesses. Through the targeted use of pulsed laser radiation, the finest drillings in the micrometer range can be realized at high speed. We offer percussion drilling and single pulse drilling, two precise drilling methods for many applications.

Use our online inquiry form to place your request through our website at any time without any additional effort. Simply upload your manufacturing data to our server and deposit the material you require.

Shims, or shims sheets / spacer sheets / shims, are used to compensate for tolerances that occur in manufacturing. In this way, components and products in fixture construction, on machines and in automobiles can be compensated for easily, cost-effectively and with high precision.

Select the material, the quantity and the sheet thickness. If you already have a technical drawing, you can upload it to our server. Wwe only need your contact details to send you an individual offer for laser cutting contract manufacturing! If you need several lamellas, you can simply send off the order form several times.

TEPROSA GmbH has specialized for many years in the manufacture of sophisticated, precisely fitting laminated cores of exceptionally high quality. In the field of electrical steel sheet, we manufacture individual laminations and sheets for stators and rotors, as well as entire sheet packages stator- or rotor packages) from various steel grades. We process grain oriented electrical steel for generators, transformers and other electrical machinery. Our most common method for packaging the individual laminations is baked enamel technology. Alternatives are welding or bolting of laminations. As a long-standing supplier to various OEMs, the quality of our work is particularly important to us. Therefore, we work according to uniform processes and thus ensure consistent quality and complete traceability of each individual production step.

Baking varnish is a special joining technology for sheet metal packages. After the individual lamellas have been cut, electrical steel with a baking varnish coating is baked into a sheet metal package in a two-stage temperature step. The result is a full-surface, solid connection between the individual sheets with complete insulation. Sheet metal packages manufactured in this way have high precision and perfect magnetic properties. Advantages of the Backlack process: The Backlack process offers several advantages over alternative packaging processes, which we will discuss in detail below. Precision – Sheets coated with baking varnish are baked over the entire surface. This means that even delicate slats can be assembled precisely.

3D-MID are three-dimensional, spatial circuit carriers. The abbreviation MID stands for Molded Interconnect Device, or also for Mechatronic Integrated Devices. The term extension Mechatronic Integrated Devices as opposed to Molded Interconnect Devices (origin Molded = injection molded) is increasingly being used, since the three-dimensional basic bodies are no longer manufactured exclusively through the use of injection molding technology and no longer exclusively from plastic.

We offer laser direct structuring (LPKF-LDS process) for the production of 3D-MID (so-called three-dimensional circuit carriers) as a service in Magdeburg. 3D-MID stands for Mechatronic Integrated Device (or Molded Interconnected Devices). The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. The LPKF-LDS process is one of the technologically leading and at the same time most economically interesting process for the production of 3D-MID. The LPKF LDS process represents the central process step. The process was developed and patented by the company LPKF Laser & Electronics AG in Hanover.

With the help of the 3D-MID process, plastic parts can be metallized not only over the entire surface, but also selectively. To do this, the plastic part is activated with a special laser at the points that are to be coated (this is referred to as laser activation or laser direct structuring). The additives contained in the plastic directly under the plastic surface are “exposed” by the laser treatment. In a chemical bath, copper particles can then be deposited specifically only on the activated surfaces. Other metals, e.g. nickel, tin or gold, can then be deposited onto the starting layer of copper. In this way, a selectively coated plastic part is obtained. MID technology thereby makes it possible to selectively coat two-dimensional and also three-dimensional plastic parts and use them, for example, as circuit carriers for electronic or mechatronic assemblies. With the LPKF-LDS process