ROTH ELEKTRONIK GMBH

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au with solder stop mask Pitch 0.40 mm (15.7mil) and 0.50 mm (19.7 mil.) Adaption board for 23 different SMD-QFP s Hole diameter 1.00 mm Prescratched rated break point for the separation of individual modules from the board Gerber data for manufacture of the solder resist masks and the soldering paste imprint will be provided free of charge on request Size 132 x 203 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 6 x 1812 Chip Kond. 2 x 2220 Chip Kond. 1 x 2308 Melf 2 x 1206 Mini Melf 6 x Suitable for Pick & Place PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip...

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm CU Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 85 solder practices for SMD standard, fine pitch, and discrete components: version quantity PLCC 52, 68, 20 QFP 44, 84, 132, 184 sq. SOT23 3 x SOT89 2 x SOT143 1 x SOT233 1 x SO14 1 x SOM16 1 x SOL20 1 x Poti. 1 x DPAK 1 x Al. Kond. 6.30 mm 1 x Al. Kond. 4.00 mm 1 x Melf 2308 2 x Mini Melf 1206 6 x Tantal Chip Kond. A 1 Tantal Chip Kond. B 1 Tantal Chip Kond. C 1 Tantal Chip Kond. D 1 0402 Chip Kond. 10 x 0603 Chip Kond. 10 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 7 x 2220 Chip Kond. 1 x 1812 Chip Kond 2 x TSOP32 1 x 5020 Schwingquarz 1 x Also very suitable for machine assembly (Pick and Place) Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for solder practices for SMD Fine-Pitch QFP 208 QFP 208 4 x For manual soldering and very suitable for machine assembly (Pick & Place) Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for machine assembly (Pick & Place) of Fine-Pitch QFP 256 QFP 256 4 x Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Hot Air Leveling (HAL lead free) Solder practice board for 11 different SMD components: 6x SO8 8x SO14 4x SO16w 4x SOT223-3 4x SO20 4x SOT89 22x SOT23 78x 1206 66x 0805 26x 1812 20x 2220 Size: 72.00 x 213.00 mm

Extender card for 19"-systems DIN 41612 C64 a+c Epoxy fibre-glass FR4 1.50 mm Single-sided 70 µm Cu Solder stop mask Component print Removable short-circuit bridges and two measuring posts for each continuous strip Signalling line pin 2 - 31 Large signalling line pin 1 + 32 Switching voltage 10 mV - 60 V Switching current 0.5 A at 24 V Rest current at 20° C max. 2 A Contact resistance 20 mOhm Extender card: 100% electronically tested Size 100.00 x 278.70 mm (132.50 x 330.70 mm with handle)

Extender card for 19"-systems DIN 41612 C64 a+c Epoxy fibre-glass FR4 1.50 mm Single-sided 70 µm CU Solder stop mask Component print Microswitches soldered with two measuring posts for each continuous strip Signalling line pin 2 - 31 Large signalling line pin 1 + 32 Switching voltage 10 mV - 60 V Switching current 0.3 A at 24 V Rest current at 20° C max. 6 A Contact resistance 30 mOhm Extender card: 100% electronically tested Size 100.00 x 278.70 mm (132.50 x 330.70 mm with handle)

Adaptacks basic board Epoxy fibre-glass FR4 1.50 mm Double sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) Size 100 x 200 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 2.54 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm