Potting of electrical & electronic assemblies,potting systems, hotmelt potting

Special machines for the automotive and supplier industry Machine system for low pressure molding - electronics encapsulation The FLEXline series offers maximum flexibility through the modular design of various variants as well as expanded options for implementing special functions. The adaptation or addition of individual mechanical components is just as possible as special programming or integration into a complete production line. In addition, various application systems are available, including hot runner systems with different nozzle geometries and arrangements. The melting units can be optimally tailored to the requirements of the respective project with different melting and conveying systems and, if project requirements differ or change, can be replaced at any time using our "plug-and-play" system. Extensive peripherals and additional options round off the system. The FLEXline can therefore be optimally tailored to the requirements of the respective project.

The CUSTOMline hot melt machine is the top solution for customized casting requirements. It is configured specifically according to customer requirements and can handle complex casting tasks with exceptional precision and efficiency. This machine is ideal for special applications where standard solutions are not sufficient. With the CUSTOMline you get a casting machine that is tailored precisely to the specific needs of your production process in order to achieve optimal results. product [hot melt application systems, hot melt coating machines for paper, hot melt, hot melt adhesives, hot melt packaging, hot melt adhesives, special machines for adhesive processing, hot melts, machines for gluing, machine for gluing, melt casting technology with hot melt, hot melt coating, gluing machines, special machines for casting, sealing, foaming, gluing, special packaging machines]

Hotmelt Extruder OptiMel has developed an extruder system that is specially adapted to the conditions and parameters in electronics encapsulation. A special design uses the advantages of the extruder when melting the materials and implements the injection via an additional piston unit. This process avoids pressure peaks and combines the advantages of extruders with the requirements when processing sensitive electronic components. product [extrusion tools, extrusion tools, hotmelt application systems, extrusion tool, extrusion tool, plastic welding extruder, hotmelt adhesive, extruder systems, extruder system, extrusion machines, hotmelt, hotmelt adhesives, extruder construction, extruder pumps, extrusion machine]

At OptiMel, you get everything from a single source to optimally use low pressure molding technology for high-quality electronics encapsulation. Thermoplastic hot melts are used as encapsulation material. Due to their range of properties, amorphous thermoplastic polyamide granules are predominantly used in low pressure molding. Thermoplastic polyolefins are also available for special applications, which are used whenever sufficient adhesion cannot be achieved with the preferred polyamides on the substrates used (e.g. cross-linked polyethylene). Due to different raw material combinations, the range of properties of these hot melt granules varies in terms of mechanical strength, operating temperatures and resistance to various media. The hot melt molding materials combine a viscosity spectrum that is favorable for the low-pressure process with a wide operating temperature range (-50 / + 150°C) and, in some cases, very good adhesive properties. Depending on the material