Potting of electrical & electronic assemblies, potting systems, hotmelt potting

Special machines for the automotive and supplier industry Machine system for low pressure molding - electronics encapsulation The FLEXline series offers maximum flexibility through the modular design of various variants as well as expanded options for implementing special functions. The adaptation or addition of individual mechanical components is just as possible as special programming or integration into a complete production line. In addition, various application systems are available, including hot runner systems with different nozzle geometries and arrangements. The melting units can be optimally tailored to the requirements of the respective project with different melting and conveying systems and, if project requirements differ or change, can be replaced at any time using our "plug-and-play" system. Extensive peripherals and additional options round off the system. The FLEXline can therefore be optimally tailored to the requirements of the respective project.

Special machines for the automotive and supplier industry Machine system for low pressure molding - electronics casting The BASEline series combines a compact design and convenient operation and can be used optimally for the majority of low pressure molding projects. Various mechanical components can be put together depending on requirements. The adapted melting device with double-acting piston pump, 4l tank volume and a melting capacity of approx. 1kg/h enables optimal processing of small to medium shot weights and/or quantities. The available clamping force of 9/12kN is suitable for casting surfaces up to approx. 3,000mm². By using the Siemens S7-1200 control with touch panel, the series offers the same ease of use as the larger series.

Optimel is your reliable partner for solutions for encapsulating electrical and electronic assemblies. The innovative Low Pressure Moulding (LPM) technology offers optimal protection against external influences such as moisture, dust and vibrations, thus ensuring the longevity and reliability of your products. The Low Pressure Moulding process or hotmelt moulding process originated in the sealing of cable harnesses in the automotive industry - today it is used in many areas for the protection of electrical and electronic components. At 5-40 bar (in individual cases up to max. 60 bar), processing takes place at a much lower pressure than in the classic hotmelt injection moulding process. This makes it easy to directly encapsulate even sensitive components such as circuit boards, sensors, etc. The cycle times are limited to pure encapsulation

At OptiMel, you get everything from a single source to optimally use low pressure molding technology for high-quality electronics encapsulation. Thermoplastic hot melts are used as encapsulation material. Due to their range of properties, amorphous thermoplastic polyamide granules are predominantly used in low pressure molding. Thermoplastic polyolefins are also available for special applications, which are used whenever sufficient adhesion cannot be achieved with the preferred polyamides on the substrates used (e.g. cross-linked polyethylene). Due to different raw material combinations, the range of properties of these hot melt granules varies in terms of mechanical strength, operating temperatures and resistance to various media. The hot melt molding materials combine a viscosity spectrum that is favorable for the low-pressure process with a wide operating temperature range (-50 / + 150°C) and, in some cases, very good adhesive properties. Depending on the material