KUK NEDERLAND - WIJDEVEN INDUCTIVE SOLUTIONS BV

Our fully automated winding centres for fine and self-bonding wire make us the perfect partner for any tasks you require. Our coils are tinned with lead-free coatings (RoHS). To manufacture self-supporting coils, we use self-bonding wire. During winding, the surface of the wire is bonded using hot air. To ensure the coil connections can be soldered, they are then stripped of insulating enamel using a fully automated milling process. PRUFREX is able to make air core coils with wire thicknesses from 0.045 to 1.6 millimetres.

Our fully automated winding centres for fine and self-bonding wire make us the perfect partner for any tasks you require. Our coils are tinned with lead-free coatings (RoHS). We can wind onto any desired coil form using many different press-in ferrite and metallic cores. Multiple tap coils are also possible. Pins are automatically applied to the coil connections during the winding process, with wire drawing electrically controlled. Our winding machines handle single-chamber and multi-chamber coils with wire thicknesses from 0.045 to 0.71 millimetres.

Preparatory, finishing and other required operations are carried out using bench drills and grinders and other small tools. For example, we provide winding of electric motor components. Polishing and polishing of workpieces. soldering of printed circuit boards, soldering, welding

Innovacera manufactures many kinds of metalized ceramic coil bodies for electrical inductors, including the H-shapes, U shape and Bone-shaped and so on. The main material of metalized ceramic coil bodies is 96 Alumina and the metallized coating material is W, Ni, Au etc. Our factory have more than 20 years of metalized ceramics producing experiences, can give a prompt solution for R&D project. The metalized bodies is partially metalized , ceramic inductor coil bodies cores can make very small size which it is big helpful for the electrical systems , wire-winding technique, electronics devices and electrical coils components miniaturization developed.