Laser lines - Import export

The Kappa 330 belong to the latest generation of automatic cutting and stripping machines. This model is compelling in the extremely broad range of processing they cover. With the simple, flexible touch controls, even difficult to process materials can be set up quickly and easily. The conversion to new types of cables can be done without tools so it is ultra-fast. This model is designed for processing cables with a cross section of up to 35mm², multicore conductors with an outside diameter of up to 16mm or flat cables with a width of up to 40mm. The customer has his choice of a belt drive or various double-roller drives depending on his requirements. The conductor diameter is automatically detected by a sensor using an inductive measuring approach. This feature greatly shortens setup and changeover and reduces operating errors. Laser and a CCD line optically measure the outside cable diameter and check that the cable is present during processing.

MicroLab 30 is designed for creating micrographs of terminals up to a diameter of 10 mm. Processing can be done in less than thirty seconds thanks to the intuitive control system and the optimized arrangement of the cutting and polishing module. An integrated line laser simplifies the determination of the microsection position. The autonomous preparation, evaluation and documentation modules that are part of the lab operate independently of each other and enable a complete on-site analysis. A standardized holder positions the sample without having to re-clamp it. The concentric arrangement of the saw blade and polishing wheel enable an optimum process sequence. Reproducible micrograph preparation is assured by the two step motors that serve as a multi-axial feed control system. The mobile MicroLab 30 requires very minimal maintenance.

Precision speed and length measurements are critical for optimization of continuous or quasi-continuous production processes. Proper utilization of these measurements can lead to lower production costs and higher product quality. The ideal sensor must exceed traditional contact encoder performance, increasing reliability and accuracy while minimizing maintenance requirements and material yield. The LSV Laser Surface Velocimeters have been designed as the ideal next generation sensors for non-contact length and speed measurement. They provide precise length and velocity data quickly and reliably for both process control and cut-to- length applications. The LSV 1000/2100 measure reliably on almost any solid surface, whether controlling processes utilizing carbon steel, shiny aluminium or oily sheets, or producing round wire and cable, or manufacturing paper, cardboard or tissue.

The PROFILEMASTER SPS 200 / 400 / 550 / 800 system is based on the laser triangulation principle using four up to eight light-section sensors. Each sensor consists of a laser transmitter and an industrial CMOS camera. The sensors are arranged in an octagonal metrology to obtain complete information about the product shape. The optics of the point laser emitter contain a cylindrical lens that generates a line. The CMOS cameras extract the position of the laser line internally using a peak detection algorithm, resulting in a sub-pixel resolution that enables high acquisition speeds. Thanks to its unique concept, precise and reliable measurements are guaranteed for virtually any shape, regardless of torsion. Likewise, an advanced software toolbox is available for measurements such as angles, widths, thicknesses, radii, depths, distances, diameters or deviation from the nominal value. The profile shapes can be easily imported using existing DXF files.

The PROFILEMASTER SPS 50/80/150 – S/N 4 system is based on the laser triangulation principle using four up to eight light-section sensors. Each sensor consists of a laser transmitter and an industrial CMOS camera. The sensors are arranged in an octagonal metrology to obtain complete information about the product shape. The optics of the point laser emitter contain a cylindrical lens that generates a line. The CMOS cameras extract the position of the laser line internally using a peak detection algorithm, resulting in a sub-pixel resolution that enables high acquisition speeds. Thanks to its unique concept, precise and reliable measurements are guaranteed for virtually any shape, regardless of torsion. Likewise, an advanced software toolbox is available for measurements such as angles, widths, thicknesses, radii, depths, distances, diameters or deviation from the nominal value. The profile shapes can be easily imported using existing DXF files.