Soldering technology - Import export

Whether an individual circuit board or full-scale, demanding device assembly – PRUFREX will manufacture your products to your individual specifications and quality guidelines. Whether it's manual soldering with robotic support, wave and selective soldering or laser soldering – in all assembly tasks, we are able to use any technique required without a problem. Depending on the component, different soldering technologies offer different advantaged. We will adjust the process individually to your project.

Our production facilities are fully up to date. Thanks to the adjustable design of our lines, we can easily implement special solutions. We have the latest generation Rehm reflow soldering systems. In particular with regard to temperature zones, they are exceedingly efficient. The soldering process takes place in a protective atmosphere. In the reflow soldering process, we process through-hole and SMD components. The number of work stages, sources of error and thermal loads is reduced. In the reflow process we are also able to solder through-hole components, thereby reducing sources of error and repeated thermal load and work stages.

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

RAFI Eltec is a technical services provider that develops and produces electronic assemblies and systems according to customer-specific requirements – from the idea to the finished product. RAFI Eltec operates 5 fully automatic SMD high-speed, precision assembly lines with nitrogen reflow soldering technology. Our focus: - BGA, µBGA, CSP - QFN, Finepitch - 0201 - Novel components - Package-on-package - Automatic optical inspection Providing maximum quality for your ideas and products is what motivates us. To achieve this, we introduce our high quality standards to projects even before manufacturing begins. As a result of our expert analysis of customer data, potential pitfalls are eliminated in advance. We document sample productions in detailed test reports and discuss them with you. Due to our state-of-the-art testing technology and our in-house test equipment construction, we increase the quality of your production while simultaneously reducing logistics costs.