Solder pastes - Import export

Our production facilities are fully up to date. Thanks to the adjustable design of our lines, we can easily implement special solutions. Printing the soldering paste takes place using the latest soldering paste stencil printers. They are so exact that even the tiniest elements can be precisely placed. The faultless print result is reliably assured with a 3D paste inspection.

The ViscoMT-XS hobbock emptying system offers a modern way of emptying containers.The following advantages result from the use of eccentric screw pumps for the removal of the medium: - container sizes from approx. 5 l to 50 l - viscosities of approx. 80,000 - 2,000,000 mPas - very low shear stress of the medium - very low pressure load of the medium (max. 18 bar) - Removal of media loaded with fillers - no backflow within the sampling pump - electrical control of the pump with pressure control - valve-free pump system - no material pressure reducer necessary due to electronic pressure adjustment - very good residual emptying (less than 1% residue) - electronic "empty" and "almost empty" message Application: - Removal of media directly from the delivery container, e.g. silicones, adhesives, resins, greases, colour pastes, metal-filled pastes (Cu and Ni solder pastes, Al and Ag pastes) - supply of media to dispensers - direct dosing as pulsation-free flow rate

The ViscoMT-XL drum emptying system offers a modern way of emptying containers. The following advantages result from the use of eccentric screw pumps for the removal of the medium: - container sizes from 50 l - viscosities of approx. 80,000 - 2,000,000 mPas - Bridge frame can be driven underneath with drums on pallets - very low shear stress of the medium - very low pressure load of the medium (max. 18 bar) - Removal of media loaded with fillers - no backflow within the sampling pump - electrical control of the pump with pressure control - valve-free pump system - no material pressure reducer necessary due to electronic pressure adjustment - very good residual emptying (less than 1% residue) - electronic "empty" and "almost empty" message Application: - Removal of media directly from the delivery container, e.g. silicones, adhesives, resins, greases, colour pastes, metal-filled pastes (Cu and Ni solder pastes, Al and Ag pastes) - supply of media to dispensers

The ViscoMT-D bin emptying system offers a modern way of emptying small containers and bins cleanly. The use of our dispenser series for the removal of the medium offers the following advantages: - container sizes from approx. 100 ml to 5 l - viscosities of approx. 80,000 - 1,000,000 mPas - very low shear stress of the medium - very low pressure load of the medium (max. 18 bar) - Removal of filler-loaded material - no backflow within the withdrawal pump - electrical control of the pump with pressure control - direct dosing from the container possible - valve-free pump system - no material pressure reducer necessary due to electronic pressure adjustment - very good residual emptying (less than 1% residue) - electronic "empty" and "almost empty" message Application: Removal of materials directly from the delivery container, e.g. silicones, adhesives, resins, fats, colour pastes, metal-filled pastes (Cu and Ni solder pastes, Al and Ag pastes)

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au with solder stop mask Pitch 0.40 mm (15.7mil) and 0.50 mm (19.7 mil.) Adaption board for 23 different SMD-QFP s Hole diameter 1.00 mm Prescratched rated break point for the separation of individual modules from the board Gerber data for manufacture of the solder resist masks and the soldering paste imprint will be provided free of charge on request Size 132 x 203 mm

AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. Advantage: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better. Disadvantage: The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。 Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

made of 100% Nonwoven PP material, with continuous filament 80 g/m² economic low lint wipe high water absorbency rate, lowlint and soft texture good water and oil absorbency suitable for cleaning of e.g. PCB solder paste, tools, machines, etc.

Screen Printer PMAXII Large scale printers such as the PMAXII from JUKI made by GKG are designed for three shift operation and a long service life with low maintenance requirements. The machine table and squeegee carrier are cast, not welded. Therefore guaranteeing high torsion resistance and ensuring the print accuracy will remain unchanged for years. JUKI’s PMAXII handles large circuit boards of sizes up to 1,220 × 800 mm and has notably specialised on LED applications.

Screen Printer JUKI’s mid size screen printer P PRIMO aims at medium format printed ciruit boards with sizes of up to 850 × 610 mm. The machine is delivered with a well structured, easy to use software, which allows the construction of a production programme in less than 8 minutes. Further functions that are included with delivery automatic stencil cleaning, 2D solder paste inspection, top and side clamping and many more!

Screen Printer G Titan JUKI’s G TITAN is equipped with premium quality functions empowering the JUKI Screen Printing Solution on its path to Industry 4.0 and “Lights Out Manufacturing”. Ease of use is provided due to a brand new GUI – Graphical User Interface – which is operated via touch screen. G TITAN supports circuit boards of sizes up to 510 × 510 mm and therefore addresses its demands towards the mid size segment. Innovative novelties such as the Opti Paste Control – OPC – as well as the Quality Print Control – QPC – represent useful individual functions to achieve optimised paste consumption, higher level of automisation and avoidance of printing errors during the screen printing process.

Optical Inspection / Solder Paste Inspection JUKI’s RV2 3DH analyzes the three dimensional shape of the completed board and compares the shape against the specification based on the outlines, heights, and brightness of the components and solder. It then judges whether the board is OK or NG (no good) based on the analysis. The 2D check function is also available.

Solder Paste Inspection JUKI’s RV 2 is an accurate high speed inline SPI machine that is equipped with an innovative i3D LED measuring head using the principle of photometric stereo technique. On top of that, it is possible to operate several RV 2 units from one workspace using Total Operation System Software – TOPSS.

Application of soldering paste Done with metal stencils by screen printing machine VERSAPRINT or by manually controlled machine UNIPRINT Maximum size of printed pattern is 610mm x 510mm We use soldering paste from Kester company, other types only when requested