Polyimides - Import export

Thickness range: 12,5-125 µm high-temperature resistant Polyimide film partially high-temperature conductive Application: Automotive, Electrical Industry, Engineering Use e.g.: Kapton®, Upilex®

TECASINT 8001 yellow brown has been made from PTFE with a modification of 20% PI. Its properties include reduced creep under load and excellent sliding and friction properties. The material is ideally suited to soft mating materials e.g. stainless steel, brass, aluminium or bronze.

Starting with the base polymer TECASINT 1011, TECASINT 1061 with 15% graphite and 10% PTFE has been developed. Its properties include very low static friction and a low coefficient of friction. The material is self lubricating, which means it also has good properties in dry running conditions. TECASINT 1061 is suitable for low friction and low wear applications at medium temperatures (<200°C) and loads.

TECASINT 2021 is a plastic reinforced with 15 % graphite and based on the base polymer TECASINT 2011. It is particularly suitable for tribological applications owing to its improved friction and wear behaviour. Thanks to its self lubricating property, TECASINT 2021 is well suited to lubricated and dry applications.

Starting with the base polymer TECASINT 2011, TECASINT 2031 with 40 % graphite has been developed. The plastic has high resistance to thermal ageing and improved self lubrication. This is accompanied by minimised thermal elongation for dimensionally stable components and increased creep strength.

The unfilled grade TECASINT 5111 natural is based on the high-performance plastic polyimide, which is characterised by its very good thermal stability with low thermal expansion. Polyimides are non-melting polymers with a service temperature of 300 °C, which is considerably higher than that of PEEK or PPS. In addition, TECASINT 5111 natural has a high creep resistance. These properties makes PI plastic ideal for applications where high temperature resistance is required, such as in the aerospace industry. TECASINT 5111 natural has good chemical resistance, especially to light acids and many organic solvents. In combination with the very good electrical insulating properties of the PI material, TECASINT 5111 natural is also perfectly suited for applications in the semiconductor industry, electrical engineering or mechanical engineering. Moreover, the polyimide material has good mechanical properties, good wear resistance and is also resistant to high-energy radiation.

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.

TECASINT 5501 ESD light-brown is an electrically modified polyimide based on the further development of TECASINT 5111. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 10 E6-10 E8 Ohm. The ESD material is therefore ideally suited for applications where electrostatic dissipation is to be ensured. Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance. The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics or in nuclear and vacuum technology.

Starting with the base polymer TECASINT 4011, TECASINT 4021 with 15% graphite has been developed. Thanks to the improved friction and wear properties, TECASINT 4011 is particularly suitable for tribological applications. It is also suitable for dry applications since the material is self lubricating.

Compared with the other TECASINT materials the TECASINT 4100 series exhibits extremely high thermal stability, extremely low moisture absorption and high mechanical rigidity. This is accompanied by a very high oxidative stability and increased resistance to chemicals. TECASINT 4111 has a very high thermal stability (HDT/A=470°C). Rigidity and modulus are significantly increased vis a vis conventional polyimides in a temperature range up to 400 °C. The material has minimal thermal and electrical conductivity. The plastic is highly pure with low outgassing in accordance with ESA regulation ECSS Q 70 20.

TECASINT 4121 is based on the base polymer TECASINT 4111, plus 15% graphite. The material is particularly suitable for tribological applications thanks to its improved friction and wear behaviour. Thanks to its self lubricating property, TECASINT 4121 is well suited to dry applications.

TECASINT 6022 is a graphite filled grade for direct forming parts with enhanced wear resistance and improved long term thermal stability. Tribological grade for bearings, washer, sliding elements

TECASINT 6032 is a highly filled grade for direct forming parts with low coefficient of thermal expansion and high creep resistance.

TECASINT 6062 is a highly filled grade for direct forming parts with low static friction. For lubricated and unlubricated tribological applications

TECASINT 6012 is an unfilled grade for direct forming parts with max. strength and elongation. Lowest modulus and thermal conductivity and optimum electrical properties.

TECASINT 8061 has been made from PTFE with a modification of 40 % PI. Compared with TECASINT 8001 it has a lower creep tendency under load, along with outstanding sliding and friction properties. The material is ideally suited to soft mating materials e.g. stainless steel, brass, aluminium or bronze.

Compared with the other TECASINT materials the TECASINT 4000 series exhibits very low moisture absorption and high oxidative stability along with improved chemical resistance. Despite its high strength, TECASINT 4011 has high elongation at break and toughness. Rigidity and modulus are significantly increased vis a vis conventional polyimides in a temperature range up to 260°C. It also has minimal thermal and electrical conductivity. The plastic is highly pure and displays low outgassing in accordance with ESA regulation ECSS Q 70 20.

Starting with the base polymer TECASINT 2011, the plastic TECASINT 2061 with 15 % graphite and 10 % PTFE has been developed. This plastic's properties include, above all, low static friction and a low coefficient of friction. Owing to its self lubricating property, TECASINT 2061 is very good for dry application. The material is suitable for low friction and low wear applications at medium temperatures (<200°C) and loads.

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS Q 70 20.

Starting with the base polymer TECASINT 1011, TECASINT 1031 has been developed. This material contains 40% graphite, unlike the starting material. TECASINT 1031 has a very high resistance to thermal ageing and improved self lubrication. Its other properties include minimised thermal elongation for dimensionally stable components and increased creep strength.

TECASINT 1021 black has been developed from the base polymer TECASINT 1011 natural. Unlike TECASINT 1011, however, it contains 15% graphite. The material has improved friction and wear properties for tribological applications. TECASINT 1021 is suitable for both lubricated and dry applications since it is self lubricating.

TECASINT 1011 is an unfilled polyimide natural grade. This material particularly stands out in the TECASINT 1000 product family for very high strength and elongation. It is characterised by properties such as a very high modulus of elasticity, high rigidity, high degree of hardness and low thermal and electrical conductivity. These are accompanied by high purity and low outgassing in accordance with ESA regulation ECSS Q 70 20. Its previous name was SINTIMID Pur HT.

Silicone heaters and Kapton heaters are preferred surface heating elements for laboratory equipment and medical technology due to their easy handling and variety of shapes. Like Kapton polyimide heating foils, silicone heaters are resistant to continuous temperatures of up to 200 °C, with self-adhesive foil up to 180 °C. When designing silicone heaters and Kapton foil heaters, the designer has almost unlimited degrees of freedom. This applies to the minimum and maximum dimensions, which are set within wide limits, as well as to contours and recesses, holes and feed-throughs of any kind. The good shape flexibility of silicone heating mats and foils as well as Kapton polyimide heaters also enables the heating of cylindrical, conical or rounded surfaces. The resistance of polyimides to fungi, bacteria, ozone, weather, ageing and most chemicals, acids and solvents is very good, making polyimide (Kapton) heaters an ideal solution for many critical applications.

In general, a Kapton film heater is always more expensive than a silicone heater or polyester heater. Where chemical resistance or the weight of the flexible heating element plays an important role, however, Kapton heaters are the ideal solution. The resistance of Kapton Polyimide to fungi, bacteria, ozone, weather, ageing and most chemicals, acids and solvents is very good, so that heating elements made of Polyimide (Kapton) are an ideal solution for many critical applications. Kapton foil heaters are also silicone-free and are characterised by an even heat distribution. The dielectric strength of a Polyimide film is very high and so the flexible Kapton (Polyimide) heater can be very thin. Due to the small thickness, the heat transfer to the component is improved and higher surface loads are possible. Typical applications for Kapton film heaters are: Laboratory technology, aircraft electronics, printers, diagnostic instruments, vacuum chambers, medical equipment and many more.

We can offer flexible heating elements manufactured from three different insulation materials: silicone, polyimide (Kapton) or polyester. Each of these materials possess different properties which make them suitable for diverse applications. Silicone heaters can also be produced in very large sizes, whereas polyimide is significantly thinner and polyester unbeatable in price when it comes to high quantities. All three of them are bespoke products made according to your needs, so within the bounds of what is technically feasible you as the customer can determine almost every feature of your heater. This can include; voltage, wattage, dimensions, shape, sensors, leads, plus much more. Due to their low thermal mass flexible polymer insulated heaters distinguish themselves by a very short response time and excellent controllability.

Available in the full pore size range, white and translucent membrane filters having wide and varied applications including air monitoring, water analysis, capture of micro-organism and blood filtration; also available in hydrophilic (PVP treated) or hydrophobic (PVP free) version. • Fully manufactured in-house from high quality polymer material (film). • Manufactured (ISO5) and converted (ISO7) in clean room environment. • Convenient and precise labelling with lot number ensuring full product traceability. • Consistent pore size for accurate separation of samples by size. • Flat and smooth surface for an easy sample analysis. • Low extractable, low protein binding, negligible adsorption and absorption. • Biocompatibility, excellent chemical resistance and thermal stability. • Supplied with a Certificate of Quality. • ISO 9001 certification.

Kapton and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board

Kapton® and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton® polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton® Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board

BASED ON POLYIMIDE FILM COATED WITH A SPECIAL SURFACE CONDUCTIVE ADHESIVE. STATIC GENERATION DURING ROLL UNWIND AND TAPE APPLICATION IS ELIMINATED. IT CAN WITHSTAND WAVE SOLDER TEMPERATURES UP TO 300C AND LEAVES NO ADHESIVE RESIDUE ON PRINTED CIRCUIT BOARDS UPON REMOVAL.