Server Storage Server RAM Memory ECC Unbuffered and Registered
Samsung/SK Hynix/Micron server memory large selection available from stock in Munich Special offers at attractive prices are regularly available, do n...
ERC400 DDR3L SO-DIMM RAM
The memory of a PC (Random Access Memory, RAM) is an important component of the computer, as it stores temporary data that the processor can access qu...
Procurement of Components
Procurement of Components...
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BMS - Battery Management System
The BMS (Battery Management System) is an electronic board integrated into lithium batteries to ensure their protection. It continuously communicates ...
XMC/PMC - CPU (XMC-CPU/T10)
XMC/PMC 64-Bit PowerPC™ T1022 Processor Board with FPGA...
Industrial Microcontrollers
High-quality microcontrollers for various industrial applications.
XC7A200T-1FBG484C XILINX - FPGAs (Field Programmable Gate Array)
Description: The XC7A200T-1FBG484C is a Xilinx Integrated Circuits (ICs) FPGAs (Field Programmable Gate Array) based on the Artix-7 series. It has a t...
Cpu Ceramic Processor Scrap (486 & 386 CPU SCRAP)
Cpu Ceramic Processor Scrap (486 & 386 CPU SCRAP)...
Thermal Conductive Adhesive Tapes - DOUBLE-SIDED FOAM TAPES (Thickness: 0.15 mm - 0.25 mm - 0.50 mm - 1 mm)
Thermal conductive tapes provide powerful heat dissipation; essential requirements for the development of electronic devices where slimmer and more ef...
SMD Resistors
Thick Film Chip Resistors Standard 0402-4020 CHS, Resistance Range: 10M ... 1T, Tolerance Range: 0.25 ... 30%, TC (ppm/K): 50 ... 3000...
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DIMM-AM335
Embedded module with Texas Instruments AM335x processor, developer kits, customizable Linux, QNX The cost-effective members of the SODIMM family, DIM...
Matrices
For every application area, we design and manufacture molds according to your specifications - from all materials. We also carry out repairs or modifi...
Drivers IGBT
POWEREX offers a variety of IGBT drivers to simplify the development of your IGBT module-based solutions (POWEREX and MITSUBISHI). The document below...
TM1 - Internet of Things Module
The TM range of computer on modules was designed to deliver ultra small and low cost modules that can be used in space and power limited applications.
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conga-QA3
- Low energy consumption of 5 to 10 watts - Intel® HD Graphics 7th generation - Industrial temperature range - 3rd generation Intel® Atom™ / Celeron®...
Embedded Software Development
You need software for your embedded device, IoT device or a device driver? Windows, Linux or cloud services? Our focus is on the development of emb...
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Embedded module - TQMa28L with ARM9 based on i.MX28
0,00 €
ARM9 module with i.MX28 from Freescale Key functionalities Smallest ARM9 module High quantity use 2x IEEE1588 Ethernet (L2 Switch) Extended temperatur...
EM05 - M.2 Form Factor
M.2 (NGFF) Module Form Factor for LTE Category The Quectel EM05 is an LTE category 4 module that adopts the standard M.2 (NGFF) form factor. The spac...
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conga-MA3E
- COM Express Mini Type 10 - 3rd Generation Intel® Atom™ - Supports ECC memory - Low power consumption, 5 to 10 Watts TDP - Intel® HD Graphics Generat...
THERMALLY CONDUCTIVE ADHESIVE TAPES - DOUBLE-SIDED FOAMS (Thickness: 0.15mm-0.25mm-0.50mm-1mm)
Thermally conductive tapes offer high performance heat dissipation; vital requirements for designing electronic devices where demand is for slimmer an...
Double-sided thermal conductive tapes - DOUBLE-SIDED FOAM TAPES (Thickness: 0.15 mm - 0.25 mm - 0.50 mm - 1 mm)
Thermal conductive tapes provide high-performance thermal dissipation; essential requirements for the design of electronic devices where the demand is...

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