Directly Laminated Copper Substrate

Direct Plated Copper (DPC) is the latest development in the field of circuit boards with ceramic substrates. In this process, a metal layer (Ti/Cu target) is deposited on the surface of the ceramic substrate using magnetron sputtering technology, resulting in varying copper thicknesses from 10 µm to 130 µm, followed by photolithography to create circuit patterns. Galvanization is used to fill the gaps and thicken the metal circuit layer, while the solderability and oxidation resistance of the substrate are enhanced through surface treatment. Finally, the dry film is removed and the seed layer is etched to complete the substrate.