PSA Adhesive Tape TAT-K-AC 0.8 W/mK

Irregularities in contact surfaces and tolerances can be compensated very well. Materials with different thermal expansion coefficients can be securely bonded and thermally connected. The overall thermal transition resistance is minimized. The material is suitable for simple, effective, and cost-efficient thermal bonding across a wide range of applications, especially where space is limited and low weight is crucial. Mechanical fastenings using screws, clamps, or rivets become unnecessary. • Low thermal resistance • Thermal conductivity: 0.8 W/mK • High dielectric breakdown strength • Reliable adhesion on uneven or difficult-to-treat surfaces • No mixing of components and curing processes as with liquid adhesives • Mechanical fastenings using screws, clamps, or rivets become unnecessary Complete detailed description...