Beloted connection wires for electrical and electronic circuits

Dr. Ing. F. Keller GmbH has developed processes in which the head region of a connection wire is encapsulated in a spherical or droplet shape with solder. This eliminates the need for complex soldering techniques or the application of solder points after the screen printing process during the assembly of complex circuits. The preferred materials for these current strips are Ag 99.9 or OFCu 3 gal Ag, with a diameter of 0.3 — 0.5 mm, and any lengths between 20 mm and 80 mm. All common solders used in semiconductor technology can be utilized according to the customer's specifications.