Automatic Assembly (SMT)
Automatic Assembly (SMT)

Automatic Assembly (SMT)

With our new all-in-one assembly system from Fuji, we achieve printed circuit board assembly using surface mount technology (SMT) - efficiently starting from a component size of 0402 and circuit boards up to 500 x 400 mm. This allows for the processing of Ball Grid Arrays and component sizes down to 0201. In SMT, we rely on an automated soldering process that enables fast and precise processing, particularly of double-sided assembled circuit boards, with the highest quality. Soldering occurs in a high-purity nitrogen atmosphere, ensuring optimal and oxidation-free soldering. Clean and residue-free. Quality assurance is carried out using powerful AOI systems from Orbotech.
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