High Density Interconnect (HDI) PCBs

•Layer: 4-24 Layers •Technology Highlights: any Layer can be connected, Multilayer with finer lines/space, up to 5 sequential laminations (N+5) •Materials: FR4, high TG FR4, low CTE, Rogers •Final Thickness: 0.4 – 3.2mm •Copper Thickness: 18μm – 70µm •Minimum track & spacing: 0.0762 mm / 0.0762 mm •Max. Size: 550x400mm •Surface Treatments: ENIG, HAL Leadfree, HASL, OSP, Imm. Tin, Imm. Ni/Au, Imm. Silver, Gold fingers •Minimum Mechanical Drill: 0.15mm, advanced 0.1mm •Minimum Laser Drill: 0.10mm standard, advanced 0.075mm To provide you with more comprehensive advice, our team at BERATRONIC is happy to assist you. We look forward to your message.