Germany, Chemnitz
42km
...Applications: - Laser cutting, dicing, and filament winding - Laser drilling using both trepanning and percussion methods - Laser microstructuring and ablation, e.g., using FSLA - Laser micro-engraving on substrate surfaces as well as internal engraving in transparent materials - Laser lift-off using DPSS lasers and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, composite materials...

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