...The DW292 has been specifically designed for cutting monocrystalline silicon ingots up to 300mm in diameter into high-quality wafers for the semiconductor industry. The newly developed DW292-300 can operate with slurry wire as well as diamond wire and features sophisticated characteristics for optimizing warp and waviness. The longer wire field, along with the higher wire speed and acceleration...
Welcome to Core Drilling Technology! Your expert for core drilling, concrete cutting, joint cutting, and demolition in civil engineering from Lübeck. Our specializations: * Diamond core drilling (core drilling 10-1200 mm in diameter) in the hardest materials * Dry core drilling (10-350 mm in diameter) in masonry, e.g., for exhaust or chimney * Diamond sawing, wire sawing, and joint...

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