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LogoMICRO SYSTEMS ENGINEERING GMBH
Germany, Berg
110km
... processes for the production of an electronic module from a single source: - Design service for ceramic, organic, and other substrates, such as thin film, DCB, etc. - Substrate manufacturing: LTCC, thick film - Assembly processes, such as SMT, flip chip, wire bonding, die attach, etc. on any base materials - Packaging processes for BGA, LGA, QFP, etc. - Special services, such as custom testing, project management, validation, global material procurement, etc.
Other products
Packaging
Packaging
SMD Assembly
SMD Assembly
LTCC Substrate
LTCC Substrate
Portfolio (3)
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