electronic device assembly Germany

...Setting up a pick-and-place machine is not economical for small series and prototypes. With the manual placement device, even the smallest quantities can be produced quickly and cost-effectively. The solder paste application is done either with a dispenser or a small stencil printer. To achieve optimal placement, fine-pitch and BGA components are re-placed using the precision placement system. The placement capacity is approximately 5,000 components per day.

Manufacturing of electronic assemblies, both conventional and SMD-mounted. PCB assembly, device manufacturing, device assembly, prototype and sample construction, material procurement.