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LogoRUHLAMAT GMBH
Germany, Marksuhl
195km
... start-up time is reduced by providing full power directly after switching on. This enables high-speed production with significantly lower cost per module, resulting in an unsurpassed value for money. Alternatively, the machine can also be equipped with UV discharge lamps or heating units. Diverse nozzle plates are available for the different module tape pitches. Thermal curing resins such as black epoxy can be processed optionally. Reliable process stations and automated inline quality control ensure highest quality at a minimum of cost per module. High-speed chip module encapsulation...
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PowerSeal - Chip Module Encapsulation Machine - Automatic chip module encapsulation with unbeaten quality and highest throughput
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