POLYAMID

Grammage: 42,5 g/m2 - 120 g/m2 High density Polyethylene Spunbond. tearproof, nailable, dimensionally stable, sewable, water- and weather resistant, printable, punchable, perforable Pre-treatment (surface): different pre-treatments, partially with antistatic properties e.g..: Tyvek® Application: Carrier Bags Application: Food Industry, Graphic Arts Industry, Label, Textile & Household Industry

Thickness range: 50-800 µm plasticizer-free, calendered film made of Polyvinylchloride Pre-treatment (surface): different roughnesses Application: Food Industry, Graphic Arts Industry, Card, Pharmaceutical Industry & Healthcare, Engineering Use, Packing

Thickness range: 25-120 µm Biaxially oriented PS-film e.g.: Polyflex® Application: Office Equipment, Interleaver Application: Food Industry, Graphic Arts Industry, Label, Packing

Description / Characteristics: Thickness range: 15-50 µm non oriented film made of Polypropylen Pre-treatment (surface): one or two sides Corona pre-treated Application: Graphic Arts Industry, Engineering Use, Lamination, Packing