MICRO SYSTEMS ENGINEERING GMBH

For over 30 years, MSE has specialized in custom solutions for microelectronics. The company is one of the leading European providers of complex LTCC (Low Temperature Co-fired Ceramic) substrates and state-of-the-art assembly and semiconductor packaging technologies, for both ceramic and organic substrates. The production of electronic modules for active implants has been one of MSE's most important business segments since its inception. Furthermore, MSE also applies its expertise and experience gained in medical technology wherever high reliability, miniaturization, high temperatures, high frequencies, or hermetic encapsulations play a crucial role. For example, in telecommunications, aerospace, and industrial electronics projects. Based on custom requirements, MSE offers all key processes for the production of an electronic module from a single source: - Design service for ceramic, organic, and other substrates, such as thin film, DCB, etc. - Substrate manufacturing: LTCC, thick film - Assembly processes, such as SMT, flip chip, wire bonding, die attach, etc. on any base materials - Packaging processes for BGA, LGA, QFP, etc. - Special services, such as custom testing, project management, validation, global material procurement, etc.