AHN pipetting instruments are a top choice for lab professionals due to their combination of innovation, robustness, and precision. They are designed to ensure comfortable operation and prevent hand stress. AHN pipettes can be color-coded for easy identification. They offer durability, calibration stability, accurate and reliable pipetting, easy maintenance and adjustment. In addition, AHN offers multiple pipette stand options to meet the needs of different labs and researchers. The options include fixed and variable place stands for 1-6 pipettes, single and multichannel, depending on the stand version. AHN also provides Bottle Top Dispensers that are available in five volumes from 0.25mL to 50 mL. They offer Universal Bottle Compatibility and chemical resistance, making them a versatile option for dispensing liquids. Lastly, the AHN Pipette Controller is designed to process liquids comfortably with Long-lasting battery capacity, making it a convenient option for lab professionals.
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Dymax Ultra LightWeld® 9501F is a UV/Visible lightcuring adhesive optimized for electric vehicle battery potting and bonding. Features: - Cure using UV/Visible light or LED - 385 nm LED Curing - Blue Fluorescing technology for bond line inspection - One part formulation – no mixing - Solvent free Excellent adhesion to metals & plastics
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Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible
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Highperformance conformal coating with secondary moisture cure for shadow areas. Features: - Cures with UV/Visible light - DualCure secondary moisture cure for shadow areas - Fluoresces blue under black lights - Excellent thermal shock resistance - High temperature flexibility - Excellent chemical and corrosion resistance - Good temperature/humidity (85/85) performance - One part formulation no mixing - Solvent free - Fast tackfree cure - Halogen free - MILI46058C Approved
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Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]
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