The new Dual Absolute technology makes it possible to eliminate the disadvantages of a classic differential system, improve its advantages and renew an industry that has been standing still for decades. Thanks to the new Dual Absolute technology, ForTest has combined the simplicity of a classic absolute decay system with the precision and sensitivity of a differential system, bringing leak testing instruments to a level never seen before. The new algorithms and measurement hardware eliminate typical defects in a differential system, such as differences in stabilization between the test part and the reference sample. The new range of instruments is able to work in 3 different ways: Pure Differential, Dual Absolute and Central Zero. The new Dual Absolute technology is so powerful and reliable that ForTest has decided to stop developing the classic differential system.
Turkey
used for leak testing of compression fittings, 7 inch touch display, thermal printer, USB data out to excel file, automatic pressure control, automatic pressure cycle control, automatic time control
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With the dual chamber PPM leak test stand, Poppe + Potthoff Maschinenbau offers a powerful system for testing sensors in medical device industry. The test stand can be implemented in R&D processes, but also during production as an end of line test. With pressures of up to 50 bars this equipment offers a large spectrum of testing opportunities in the medical area. Some Global Test Standards include: ISO 14644 ASTM G122-96 ASTM D6361 SAE AMS 0302 The PPM leak test stand is able to be programed to the customers requirement. The powerful in house built software enables exact design of pressure curves, such as holding times and exact pressure increase over time. It is an ideal solution for any sorts of plastic components. This exemplarily displayed test bench can utilize air or nitrogen as a test medium. Please get in touch about any other test mediums. In addition the PPM test benches can perform tests of multiple test units at a time.
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Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries.
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